BCM Advanced Research, a supplier of embedded motherboards and intelligent systems
BCM Advanced Research
Delivering Quality Intelligent Computing Systems
ESM-KBLH
7th Gen Intel Core™ Processors i7/i5/i3 Type6 COMe Basic Module with Intel® QM175 Chipset
Product Features
Bookmark and Share
  • Onboard 7th Gen Intel® Core™  i7/i5/i3 Processor
  • Two 260-pin SoDIMM DDR4 SDRAM slot up to 32GB
  • Dual-channel 18/24-bit LVDS, VGA, DP/HDMI/DVI, eDP Option
  • Intel® I219LM Gigabit Ethernet PHY
  • 8 PCIe x1, 4 SATA, 8 USB 2.0, 4 USB 3.0
  • HD Audio Interface
  • Type 6 Rev 2.1 Pin-out
  • TPM 2.0
ESM-SKLH Intel Skylake Type6 COMe COM Express Module

Click Thumbnail to Enlarge
Product Description
System
CPU 7th Gen Intel® Core™ i7-7820EQ 4-Core 3.0GHz processor
7th Gen Intel® Core™ i5-7440EQ 4-Core 2.9GHz processor
7th Gen Intel® Core™ i3-7100E, 2-Core, 2.9GHz processor
BIOS AMI uEFI BIOS, 128Mbit SPI Flash ROM
System Chipset Intel® QM175 Express Chipset
System Memory 2 x 260-Pin DDR4 2400/2133MHz SoDIMM up to 32 GB
Expansion 8 x PCIe x1
OS Support Win 10 Linux (Kernel>4.5) (64-bit
I/O Chip EC ITE IT8528E
Display
Chipset Intel® Kaby Lake SoC integrated Graphics
Resolution HDMI 1.4: 4096 x 2160 @24Hz (only one display output);
DP 1.2: 4096 x 2304 @60Hz (only one display output);
eDP 1.4 (optional): 4096 x 2304 @60Hz (only one display output);
LVDS (via eDP-to-LVDS): 1920 x 1080 @60Hz;
VGA (via DP-to-VGA): 1920 x 1080 @60Hz
Multiple Display (VGA+DP)+HDMI+DDI
LVDS+(VGA+DP)+DDI
LVDS+(VGA+DP)+HDMI
LVDS+HDMI+DDI
LCD Interface CH7511B (eDP to LVDS)
I/O
MIO 1 x SMBus
1 x LPC
1 x I2C
USB 8 x USB 2.0
4 x USB 3.0
DIO 1 x 8-bit GPIO
Other 2 x UART
4 x SATA III
Audio
HD Codec Intel® High Definition Audio
Audio Interface ---
Ethernet
LAN Chip 1 x Intel® i219LM
Ethernet Interface 10/100/1000 Base-Tx GbE compatible
Mechanical and Environment
Power Requirement +9V ~ +19V
ACPI Single Power ATX Support S0, S3, S4, S5
ACPI 5.0 Compliant
Power Type AT/ATX
Operating Temperature 0°C ~ 60°C (32°F ~ 140°F) (Standard)
Storage Temperature -40°C ~ 75°C (-40°F ~ 167°F)
Operating Humidity 0 ~ 90% Relative Humidity, Non-condensing
Form Factor COM Express Modules
Dimensions (L) x (W) 5" x 3.7" (125mm x 95mm)
Weight 0.44 lbs (0.2kg)
Ordering Information
Part No. Description
ESM-KBLH-7820EQ Intel QM175 Core i7-7820EQ Type6 COMe Module
ESM-KBLH-7440EQ Intel QM175 Core i5-7440EQ Type6 COMe Module
ESM-KBLH-7100E Intel QM175 Core i3-7100E Type6 COMe Module
EEV-EX14 COM Express Type 6 Carrier Board (uATX) for Evaluation
* All product specifications and product images are subject to change without notice. Last update: 9/18/2017


About BCM
BCM Advanced Research (BCM) is a leading developer and manufacturer of x86/ARM RISC embedded industrial motherboards and systems for ODMs and OEM that integrate computing technology into their products. We own a very strong R&D engineering team and operation department based in Southern California in order to provide prompt project develop support and instant problem solving assistance.