4 x (Gold Plated) DIMM slots support up to 64 GB
Dual Channel DDR4 2133MHz System Memory
Supports 3 Independent Display
Video interfaces: 2 x DisplayPort (DP++) (Gold Plated), DVI and LVDS, Optional eDP
1 x PCIe x16 Slot (Gold Plated)
1 x PCIe x4 Slot (x16 Physical Slot) (Gold Plated)
2 x PCIe x1 Slot Open End (Gold Plated)
1 x Full/Half Size mini-PCIe (Gold Plated) PCIe/ USB
1 x M.2 Slot (with PCIe x4 / SATA III) Type 2280 and 2260
Onboard USB: 2 x USB 3.0 (Gold Plated), 4 x USB 2.0 (Gold Plated) and 1 x USB 2.0 (1x5 Connector)
USB at Rear I/O: 4 x USB 3.0 and 2 x USB 2.0
6 x SATA III (Gold Plated)
6 x COM Ports
Optional TPM 2.0
Intel Active Management Technology 11
Kaby Lake processors support Win 10 and above; support Win 7 with external video cards
6th Gen Skylake processors support Win 7
¹ Kaby Lake processor support BIOS will be a running change estimated to be in stock starting late Q3/Q4 2017 implementing important new ME code updates. Qual-samples are available now on a limited quantity basis. OS Win 10 and above; support Win 7 with external video cards.
BCM's RX170Q uATX motherboard is designed to ensure the highest reliability utilizing gold plated pins for its critical high-speed connectors including memory, SATA, PCIe, power, M.2, and USB 3.0. Additionally, these connectors are locking type. This combination of gold plating and locking ensures superior high speed signal conductivity, wear and corrosion resistance in tough environments, and that critical connections stay connected. The RX170Q delivers high performance and higher reliability especially designed for test instruments, medical devices, video intensive applications, and any equipment that may be mobile and subject to connector wearing vibrations.
The RX170Q is a high performance and high reliability Micro ATX motherboard for applications that require intensive graphics and video performance or the capability to process multiple complicated tasks simultaneously. Such applications include medical imaging systems, CT Scanners, industrial x-ray scanning systems, microscopes & imaging equipment, test instruments, gaming devices, video servers, surveillance systems, and DVR systems, to name a few.
1 x PCIe x16 Slot (Gold Plated) (Black)
1 x PCIe x4 Slot (x16 Physical Slot) (Gold Plated) (Yellow)
2 x PCIe x1 Slot Open End (Gold Plated)
1 x Full/Half Size mini-PCIe (Gold Plated) PCIe/ USB
1 x M.2 Slot (with PCIe x4 / SATA III) Type 2280 and 2260
Watchdog Timer
Reset: 1 sec. ~ 255min. and 1sec. or 1min./step
H/W Status Monitor
Monitoring System Temperature, Voltage, with Auto Throttling Control
TPM
Optional TPM 2.0
Display
Graphics Engine
Intel® Integrated Graphic
Display Interfaces
2 x DisplayPort (supports DP++) (Gold Plated), 1 x DVI-D, Optional eDP
Display Capability
Supports 3 Independent Display
External I/O
KB/MS
1 x PS/2 Keyboard & Mouse
Audio
Line-in, Line-out, Mic-in
USB
4 x USB 3.0 and 2 x USB 2.0
COM
1 x RS-232/422/485
LAN
2 x RJ45
DVI
1 x DVI-D
DisplpayPort
2 x DisplayPort (supports DP++) Connector (Gold Plated)
Optional eDP
Internal I/O
LVDS
1 x 18/24 bits Dual Channel LVDS
USB
1 x 2x10 USB 3.0 Connector ( 2 x USB Ports) (Gold Plated)
2 x 2x5 USB 2.0 Connector ( 4 x USB Ports) (Gold Plated)
1 x 1x5 USB 2.0 Connector (1 x USB Port)
COM
5 x RS-232 Headers with Voltage Selection (2.0mm Pitch Locking Type)
SATA
5 x SATA III Connectors (Red) (Gold Plated)
1 x SATA III Connectors (Black) (Shared with M.2) (Gold Plated)
MIO
1 x LPT, 1 x SPI, 1 x Front Audio, 1 x Amplifier, 1 x Front Panel (Gold Plated), 1 x 8-bit GPIO, 1 x 4 Pin CPU Fan, 2 x 4 Pin Chassis Fan, 1 x Socket Type CMOS Battery Holder, 2 x LAN Status LED Headers, 1 x Backlight Locking Type Header (Gold Flashed), 1 x Chassis Intrusion Locking Type Header (Gold Flashed)
Mechanical and Environment
Power Type
1 x 24-pin ATX Connector (Gold Plated)
1 x 4-pin ATX 12 Connector (Gold Plated)
AT/ATX Mode Jumper
Operating Temperature
0 ～ 60°C （32 ～ 140°F）
Storage Temperature
-20 ～ 80°C （-4 ～ 176°F）
Operating Humidity
5 ～ 90％ Relative Humidity, Non-condensing
Storage Humidity
5 ～ 90％ Relative Humidity, Non-condensing
Form Factor
uATX (Micro ATX)
Dimensions (L) x (W)
9.6" (L) x 9.6" (W)
Certification Information
CE, FCC Class B
Weight
1.45 lbs
* All product specifications and product images are subject to change without notice. Last update: 10/5/2023
BCM's RX170Q Micro ATX motherboard supports the 7th generation 14nm Intel Core i7, i5, i3 and Celeron processors, code named Kaby Lake platform. These processors offer faster CPU performance and stunning graphics with optimized 4K capabilities and improved power efficiency over the 6th generation processors...
BCM, a leading supplier of industrial motherboards and an associate member of Intel® IoT Solutions Alliance, announces a running change on its Q170 and H110 series industrial motherboards to support the latest 7th generation (Kaby Lake) Intel® Core™ processors on its existing motherboard platforms including the MX170QD, MX110HD, MX110H mini-ITX and RX170Q and RX110H micro ATX boards. 7th generation Kaby Lake support will be in addition to the currently supported 6th generation (Skylake) processors. This running change enables these motherboards to support two generations of processors extending their mainstream lifecycles while taking advantage of the 7th generation Core performance and feature enhancements. For customers who are looking for smaller embedded computing platforms in Kaby Lake, BCM offers its ESM-KBLH Type 6 COM Express module and ECM-KBLH 3.5” Single Board Computers. These running changes will take place starting in Q2, 2017. For more information please contact your BCM representative or email us at BCMSales@bcmcom.com....
BCM Advanced Research, a leading designer and manufacturer of industrial motherboards and systems since 1990, and an Associate member of the Intel® Internet of Things Solutions Alliance, today launched five new industrial motherboards based on the latest 6th generation Intel® Core™ processor family (codename Skylake). The new BCM motherboards include RX170Q and RX110H (micro-ATX), MX170QD and MX110H mini-ITX, and the ESM-QM170 (COM Express module) offer dramatically higher CPU and stunning graphics performance, a wide range of power and feature scalability, and new advanced features that boost IoT designs from the edge to the cloud.
Please Note - By downloading the files from BCM website, you agree to accept the terms and conditions.
REVISED Multi-product PCN for phasing out the Intel® I211 Ethernet Controller and phasing in the Intel® I210 Ethernet Controller. Please note there were hardware (H/W) revision inconsistencies with the previous notification sent on September 28, 2022. BCM apologizes for any inconvenience this may have caused our customers.
09/28/2022
Multi Product Hardware and BIOS PCN for phasing out the Intel® I211 Ethernet controller and phasing in the I210 Ethernet controller.
05/12/2022
PCN for the RX170Q series to address multiple components that are either EOL and/or highly constrained and severely impacting production lead-time.
12/14/2020
Multi-product change notice (PCN) to replace the audio codec on a significant number of BCM motherboards due to an end of life notification from the audio codec manufacturer. This change will involve both a BOM change (adding the replacement audio codec to the bill of materials) as well as a BIOS update to support the new audio codec.
12/07/2020
PCN for the RX170Q pertaining to a Vcore controller IC revision change from B to C
08/28/2018
PCN for including a warning insert into each carton in order to comply with California Proposition 65 regulations.
Please contact your BCM representative with any questions pertaining to this PCN.
8/30/2017
RX87Q, MX87QD, RX170Q, MX170QD PCN: To address an Intel® security advisory regarding a critical firmware vulnerability in certain systems that utilize Intel® Active Management Technology (AMT), Intel® Standard Manageability (ISM) or Intel® Small Business Technology (SBT). (Documented in Intel CVE-2017-5689).
Pre-notice of a pending multi-product BIOS change that will be implemented approximately in Q2/2017. This change is being implemented to add support for the newest Kaby Lake CPUs on our current Skylake industrial motherboards.
BCM is committed to always providing the latest and most updated technology to our customers on any given product platform. Although we try to avoid major changes as much as possible once a product is launched, when a significant technology enhancement such as this one becomes available so close after the initial launch of a new product we are compelled to make it available for the benefit of all customers. The estimated release date for these new BIOS is late Q1/2017.
08/25/2016
In order to comply with the latest product labeling regulatory requirements for shipping products with a Lithium battery installed, please find the attached packaging change notice from BCM covering multiple products. This label is required to make transporters aware that the contents they are transporting do contain Lithium batteries. This notification may result in the transporter requesting additional data for goods that will require air transport.
