BCM motherboards now supporting 9th Generation Intel® Coffee Lake Refresh processors

BCM is pleased to announce its full range of Coffee Lake industrial motherboards now support the latest 9th Gen Intel® Core™ H and S processors, codename Coffee Lake Refresh, serving as a successor to 8th Gen Coffee Lake series. Now BCM’s entire Coffee Lake industrial motherboard family including the BC370Q and BC246C (ATX), RX370Q (uATX), MX370QD and MX310HD (mini-ITX) are able to support both the 8th and 9th Gen Intel® Core™, Celeron, and Pentium processors ranging from 4 core to select 8 core processors. In addition to running both 8th and 9th Gen Intel® Core™ processors, this family of high-performance industrial motherboards also supports Intel® Optane™ and the latest DDR4-2666 memory delivering the capability needed to consolidate multiple workloads and accelerate the computing power to drive the ever expanding capability of your products.

The BC370Q, BC246C, RX370Q, MX370QD and MX310HD motherboards are equipped with socket LGA1151 and Intel® Q370 or H310 PCH. These boards support scalable CPU performance, rich expansion and I/O interfaces including multiple DP or HDMI, LAN ports, USB 3.1 Gen 1&2 type C USB connectors with high-speed connectivity. All of the above Q370 based products support three independent displays and deliver smooth 4K content streaming on multiple displays supporting simultaneous ultra-high-definition video feeds, enhanced speech recognition, and audio playback.

Intel® Q370/C246 PCH Chipset 4 x DIMM sockets support up to 64GB Dual Channel DDR4 2666/2400/2133MHz system memory 1 x PCIe x16, 2 x PCIe x4, 2 x PCIe x1, 2 x PCI, 2 x M.2 Supports Triple Displays: 1 x HDMI, 2 x DisplayPorts, 1 x VGA Onboard USB: 8 x USB 2.0 and 1 x USB 3.1 Gen 2 Header (2 Ports on Header) External USB: 6 x USB 3.1 Gen 1 (Speed up to 5Gbps) and 1 x USB 3.1 Gen 2 Type C (Speed up to 10Gbps) Connectors 6 x COM Ports Supports TPM 2.0 Form Factor: ATX	High Reliability Gold Plating Connectors Intel® Q370 PCH Chipset 4 x Gold Plated DIMM sockets support up to 64GB Dual Channel DDR4 2400MHz system memory Optional ECC Memory Support 2 x Gigabit LAN: Intel® I219-LM and Intel® I211-AT Rich expansion interfaces with gold plated slots 6 x SATA III, 9 x USB 3.0, 6 x USB 2.0, 6 x COM Supports SATA RAID 0, 1, 5 and 10 Intel AMT 12 Supports TPM 2.0 Form Factor: uATX
High Reliability Gold Plating Connectors Intel® H370 PCH Chipset 2 x SoDIMM sockets support up to 32GB Dual Channel DDR4 2400MHz system memory PCIe x16, M.2 Type M and Type A/E Supports Triple Display: 1 x HDMI, 2 x DP and/or LVDS 4 x USB 3.1 Gen 1 4 x USB 3.1 Gen 2 1 x USB 3.1 Gen 2 Type C 2 x USB 2.0 2 x COM Ports, 2 x SATA III Supports TPM 2.0 Form Factor: mini-ITX	Intel® H310 PCH Chipset 2 x SoDIMM sockets support up to 32GB Dual Channel DDR4 2400MHz system memory 1 x PCIe x4, 1 x M.2 Type M 2242/2280, 1 x M.2 Type A/E 2230 Supports Dual Display: 1 x HDMI, 1 x DisplayPort, 1 x LVDS 4 x USB 3.1 Gen 1, 4 x USB 2.0 2 x COM, 2 x SATA III 12V-24V Wide Range DC-In Supports TPM 2.0 Form Factor: mini-ITX

For Embedded IoT & AI Applications

The BC370Q, BC246C, RX370Q, MX370QD and MX310HD are all long-life industrial motherboards and ideal solutions for embedded IoT optimized applications such as interactive high definition visual retail signage, industrial automation, digital security and surveillance, and cutting edge healthcare devices. Contact BCMSales@bcmcom.com to initiate free consultation for your ODM projects now.

Availability and Migration from 8th Gen Intel® Coffee Lake Platform

For customers that own the previous generation BC370Q, BC246C, RX370Q, MX370QD, MX310HD motherboard products and plan to migrate to support the 9th Gen CPU, please contact your BCM representative for more information regarding forward compatibility.

Member of the Intel® Internet of Things Solutions Alliance     

BCM is an associate member of Intel IoT Alliances. This membership opens a wide door for BCM to align closely with Intel® to better serve our clients in their use and adoption of Intel® embedded architecture.  As an Intel® Internet of Things Solutions Alliance Associate member, BCM stays technologically connected through in receiving early access to the latest Intel® technical roadmaps, test platforms, design support, and business objectives.  Additionally, our R&D engineers and account managers will be in a position to better serve our clients by further educating themselves about the latest Intel® embedded technologies and by actively participating in Intel® training, market development programs, and other ecosystem activities.