BCM announces ESM-APLM Type10 COMe mini module and EEV-EX15 mini ITX Carrier Board

BCM, an associate member of Intel® Internet of Things Solutions Alliance, has released its ESM-APLM Type 10 Computer-on-Module (COMe) mini module and its compatible carrier board EEV-EX15 in mini-ITX form factor. COMe mini module is an ultra-compact form factor. Its size measures 84mm x 55mm which is similar to the size of a credit card. The COMe mini module is designed for applications that require low power with a thermal design power (TDP) of 6 watts or lower. The COMe mini module is an ideal solution for small handheld devices for market segments including industrial, medical, transportation, outdoor digital signage, and outdoor controllers.

Type10 COMe mini Module

ESM-APLM is a Type 10 COMe mini module, and it is equipped with the Intel® Apollo lake Pentium® N4200 2.5GHz or Celeron® N3350 2.4GHz SoC processors. The module provides onboard DDR3L memory for up to 8GB at 1866MT/s speed. For storage, onboard eMMC 5.1 up to 128G is provided as an optional SKU.

For video performance, ESM-APLM supports the latest Intel® Gen9 Low Power graphics, up to 4K resolution and H.265 codec. In additional, it supports single channel 18/24-bit LVDS up to 1920 x 1200 @60Hz from eDP-to-LVDS IC CH7511B.

Expansion interface includes one PCIe x4 (supports x1, x2, x4, with PCIe x4 optional by removing the onboard Ethernet) and compliant with PCIe Gen2 5.0 GT/s. Other extensive IO support includes two SATAIII 6 Gb/s, two USB 3.1 (Gen1) and eight USB 2.0.

Carrier Board for Type10 COMe mini module

EEV-EX15 is a carrier board in mini-ITX form factor designed with PICMG® COM Express® revision 3.0 to support Type 10 COMe mini modules including the ESM-APLM. EEV-EX15 supports rich IO interface including one LVDS, one eDP, one DP, one HDMI, two SATAIII, one COM Express connector, six USB2.0, two USB 3.1 (Gen1), one LAN, one SDIO, and one fan. Mic-in and line-out audio interfaces are provided. One PCIe x4 Slot is provided to support two types of PCIe expansion boards, PCIe and LAN, for testing. The PCIe expansion board provides additional PCIe slots; the LAN expansion board provides additional four LAN ports.

ESM-APLM Product Features	EEV-EX15 Product Features
COM Express™ 3.0 Mini Type 10 Module with Intel® Pentium® /Celeron ® SoC BGA Processor Onboard DDR3L memory up to 8 GB at 1866 Support single-channel 18/24-bit LVDS, Display Port, HDMI, DVI, eDP (Optional) Intel® WGI211AT Gigabit Ethernet 1 PCIex 4 ,2 SATA III, 8 USB 2.0, 2 USB 3.1 (Gen1) HD Audio Interface +4.75 ~ +20V Wide Range Power Input eMMC 5.1 (optional)	PICMG®COM Express® Revision 3.0 supports Type 10 Mini modules LVDS/eDP x 1, DP/HDMI x 1 Audio Interface MIC IN, Line OUT 1PCIe x 4 Slot 2 x SATAIII, 1 x COM Express connector, 6 x USB2.0, 2 x USB3.1 GEN 1 (contain 2 x USB2.0), 1 x LAN,1 x SDIO, 1 x IET, 1 x FAN Type 10 Pin-out

PCIe Expansion Boards for EEV-EX15

There are two types of expansion boards designed for the EEV-EX15 carrier board for additional four PCIe slots or four LAN ports.

Expansion board for PCIe	Expansion board for LAN

For more information please contact us at BCMSales@bcmcom.com or visit us at www.bcmcom.com.

Member of the Intel® Internet of Things Solutions Alliance

BCM is an associate member of Intel IoT Alliances. This membership opens a wide door for BCM to align closely with Intel® to better serve our clients in their use and adoption of Intel® embedded architecture.  As an Intel® Internet of Things Solutions Alliance Associate member, BCM stays technologically connected through in receiving early access to the latest Intel® technical roadmaps, test platforms, design support, and business objectives.  Additionally, our R&D engineers and account managers will be in a position to better serve our clients by further educating themselves about the latest Intel® embedded technologies and by actively participating in Intel® training, market development programs, and other ecosystem activities.