BCM introduces EPX-APLP Pico-ITX ultra-small form factor industrial motherboard with Intel N3350 processor onboard

BCM, an industrial motherboard solution provider and an associate member of the Intel® Internet of Things Solutions Alliance, introduces EPX-APLP Pico-ITX industrial motherboard designed with the Intel® Celeron® N3350 processor, codenamed Apollo Lake. Measuring a mere 3.94” x 2.83” (100mm x 72mm), the Pico-ITX SBC provides system developers and OEMs with an ultra-compact yet highly integrated platform to deliver excellent computing performance while meeting customer requirements for a compact-size, fanless, and low power consumption single board computer.

The EPX-APLP is applicable to various space-constrained embedded applications such as robotics, automation, digital signage, IoT, and mobile computing to name a few.

Product Features:

Intel® Celeron® N3350 Processor Onboard 1 x 204-pin DDR3L 1600 & 1333MHz SO-DIMM supports up to 8GB DP++, HDMI, Dual channel 18/24-bits LVDS 2 x Intel® i211AT Gigabit Ethernet Realtek ALC662 Audio Codec 1 x M.2 Type B 3042/2242/2260, 1 x M.2 Type A 2230 1 x SATA III, 1 x SATA Power, 4 x USB 2.0, 2 x USB 3.0 1 x RS232, 8-bit GPIO DC in +12V Pico-ITX Form Factor Dimension: 3.94” x 2.83” (100mm x 72mm)

For more information please contact us at BCMSales@bcmcom.com or visit us at www.bcmcom.com.

Member of the Intel® Internet of Things Solutions Alliance

BCM is an associate member of Intel IoT Alliances. This membership opens a wide door for BCM to align closely with Intel® to better serve our clients in their use and adoption of Intel® embedded architecture.  As an Intel® Internet of Things Solutions Alliance Associate member, BCM stays technologically connected through in receiving early access to the latest Intel® technical roadmaps, test platforms, design support, and business objectives.  Additionally, our R&D engineers and account managers will be in a position to better serve our clients by further educating themselves about the latest Intel® embedded technologies and by actively participating in Intel® training, market development programs, and other ecosystem activities.