This is an OEM Only product!

This product is marked as "OEM Only". OEM products are designed for OEMs with ongoing and consistent order requirements and subject to minimum order quantities. Evaluation units are available without such restrictions. BCM has multiple stocking distributors that may be able to work with OEMs to streamline product deliveries. Please contact BCMSales@bcmcom.com Sales for more information.

ESM-HRPL COM-HPC module on EEV-HC10 EATX Carrier Board

EEV-HC10

EATX Form Factor Carrier Board for COM-HPC Module

EATX form factor (12” x 13”, 305 x 330mm)
PICMG® COM-HPC® Revision 1.2, COM-HPC client pin-out, size A (95x120mm), B (120x120mm), and C (160x120mm) compatible
Unmanaged COM-HPC Carrier (C.U.)
1 x PCIe x16 Gen5, 8 x PCIe x4 , 1 x PCIe x1 for BMC
Flexible external I/O interfaces via IET modules - more DP/HDMI, USB, USB Type C, LAN ports
12-bit GPIO
2 x Serial Port/UART

Compatible COM-HPC Module

I/O
Expansion	1 x PCIe x16 Gen5 socket 8 x PCIe x4 sockets 1 x PCIe x1 socket for BMC
USB	4 x USB3.2 Gen2x2 (Type C) by 2 x IET module 4 x USB2.0 by pin header
SATA	2 x SATAIII
Video	Via IET Modules: 3 x DDI configurable to DP2.1 or HDMI 2.1b by 2 x IET modules 1 x eDP
Audio	Line-out, Mic-in
LAN	Via IET Modules: 2 x 10 or 25 Gigabit Ethernet connector by 1 x IET module 2 x 2.5 Gigabit Ethernet connector by 2 x IET modules
COM Port/UART	2 x Serial Port
DIO	1 x 12-bit GPIO
Mechanical and Environment
Operating Temperature	0°C ~ 60°C (32°F ~ 140°F) with 0.5m/s air flow
Storage Temperature	-20°C ~ 75°C (-4°F ~ 167°F)
Operating Humidity	40°C @ 95% Relative Humidity, Non-condensing
CE, FCC, RoHS Compliant	CE, FCC, RoHS Compliant
Form Factor	Extended ATX (EATX)
Dimensions (L) x (W)	12” x 13” (305 x 330mm)

* All product specifications and product images are subject to change without notice. Last update: 05/21/2025

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Document
Datasheet

Model Name	Description
EEV-HC10-A1R	EATX Carrier Board for COM-HPC Module

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