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OEM Only

OEM products are designed for OEMs with ongoing and consistent order requirements and subject to minimum order quantities. Evaluation units are available without such restrictions. BCM has multiple stocking distributors that may be able to work with OEMs to streamline product deliveries. Please contact BCMSales@bcmcom.com Sales for more information.

COM-HPC Module

ESM-HRPL COM-HPC module

ESM-HRPL

COM-HPC® Client Size C Module. LGA1700 socket supports 12/13/14th Gen Intel® Core™ Processors

Type 6 COM Express (COMe)

Arrow Lake Type 6 COMe

ESM-ARL

Type 6 COM Express (COMe) Rev. 3.1 Module with Intel® Core™ Ultra Processor U/H Series (TDP 15W/28W)

ESM-RPL Raptor Lake Type6 COMe Module

ESM-RPL

Type6 COM Express Module with Intel® 13th Generation Core™ i3/i5/i7 Embedded Mobile Processor

ESM-TGH Type 6 COMe Tigher Lake 11th Gen

ESM-TGH

PICMG COM R3.0 Type 6 module, 11th Gen Intel® Xeon/Core™ Processor

ESM-CFH Type 6 COMe Coffee Lake

ESM-CFH

PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/Core™ i7/i5/i3 Processors with CM246/QM370 Chipset

Compact Type 6 COM Express (COMe)

ESM-TWLC Compact COMe Twin Lake

ESM-TWLC

Compact Type 6 COMe Module with BGA Intel Atom® Processor N150, N250, or Intel® Core™ 3 Processor N355 (Twin Lake Platform). Standard Temp.

ESM-ASL Amston Lake Type 6 COMe

ESM-ASLC

Compact Type 6 COMe Module with Intel Atom® x7000RE Series Processors (Amston Lake Platform). Wide Temp.

ESM-EHLC Elkhart Lake Compact Type 6 COMe

ESM-EHLC

Compact Type 6 COMe Module with Intel® Atom™ 4-cores SoC BGA Processor Onboard

Evaluation Carrier Board

EEV-EX14 Carrier Board uATX Form Factor

EEV-EX14

Micro ATX Type6 COM Express Carrier Board

EEV-EX16 Carrier Board uATX Form Factor

EEV-EX16

Micro ATX Type6 COM Express Carrier Board PICMG® COM Express® Revision 3.0

COM Express Modules (COMe)

COM Express Module, computer-on-module (COM), is a very compact and highly integrated embedded computer module that works with compatible carrier board with I/O interfaces, memory, storage, connectors or form factors. Separating the design of the carrier board and COMe module makes design concepts more modular, cost effective and faster time-to-market solution.

COMe module provides many features required by various industry or applications needing high performance combined with specialized computing requirements not available off-the-shelf. It is an ideal solution for hosting embedded edge computing nodes, high-performance medical devices incorporating unique custom IP on the custom carrier board, casino gaming applications with customized gaming circuitry, or any high-end computing application that requires unique customization or feature requirements that can quickly be designed onto a carrier board that hosts the COM Express module versus a more lengthy ground up design on a single board platform. Target market for this type of high-performance, high customization/specialization, and quick time to market product include Medical devices, AI & Automation applications, AI in Transportation applications, Casino Gaming, AI in Security applications, Simulation Digital Broadcasting.

Contact us at BCMSales@bcmcom.com or give us a call 949-470-1888

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