• Home
  • |
  • eShop
  • |
  • Contact
  • |
  • Product Guide
  • |

OEM Only

OEM products are designed for OEMs with ongoing and consistent order requirements and subject to minimum order quantities. Evaluation units are available without such restrictions. BCM has multiple stocking distributors that may be able to work with OEMs to streamline product deliveries. Please contact BCMSales@bcmcom.com Sales for more information.

COM Express Modules (COMe)

COM Express Module, computer-on-module (COM), is a very compact and highly integrated embedded computer module that works with compatible carrier board with I/O interfaces, memory, storage, connectors or form factors. Separating the design of the carrier board and COMe module makes design concepts more modular, cost effective and faster time-to-market solution.

COMe module provides many features required by various industry or applications needing high performance combined with specialized computing requirements not available off-the-shelf. It is an ideal solution for hosting embedded edge computing nodes, high-performance medical devices incorporating unique custom IP on the custom carrier board, casino gaming applications with customized gaming circuitry, or any high-end computing application that requires unique customization or feature requirements that can quickly be designed onto a carrier board that hosts the COM Express module versus a more lengthy ground up design on a single board platform. Target market for this type of high-performance, high customization/specialization, and quick time to market product include Medical devices, AI & Automation applications, AI in Transportation applications, Casino Gaming, AI in Security applications, Simulation Digital Broadcasting.

Next Gen Intel® Platform

ESM-ARL
ESM-ARL
Coming Soon

Type6 COM Express (COMe) Rev. 3.1 Module with Intel® Core™ Ultra Processor U/H Series (TDP 15W/28W)

ESM-TWLC
ESM-TWLC
Coming Soon

Type6 Compact COMe Module with BGA Intel Atom® Processor N150, N250, or Intel® Core™ 3 Processor N355 (Twin Lake Platform)

ESM-HRPL
ESM-HRPL
Coming Soon

COM-HPC® Client Size C Module. LGA17xx/LGA18xx socket supports 12/13/14th Gen Intel® Core™ Processors

ESM-ASLC
ESM-ASLC

Compact Type6 COMe Module with Intel Atom® x7000RE Series Processors (Amston Lake Platform)

13th Gen Intel® Platform

ESM-RPL
ESM-RPL

13th Gen Intel® Raptor Lake H/P-Series BGA Processor Type6 COMe Module. Wide-temp processor available.

11th Gen Intel® Platform

ESM-TGH
ESM-TGH

PICMG COM R3.0 Type 6 module, 11th Gen Intel® Xeon/Core™ Processor

HDMI 2.0b, DP 1.4, LVDS, VGA
4xUSB 3.2 Gen2x1 (10 Gbps), 8xUSB 2 .0, 4xSATA III, 8-bit GPIO, I2C, SPI, SMBus, 2 x UART
1 x Gen4 PEG x16, 8 x PCIe x1
+9V ~ +19V
ESM-EHLC
ESM-EHLC

Intel® Atom™ 4-cores SoC BGA Processor Onboard

HDMI, DP, LVDS, VGA
8xUSB 2.0, 4xUSB 3.2 Gen2 x1 (10 Gbps), 2xUART, 2xSATA III
3 x Gen3 PCIe x1 (8.0 GT/s)
+9V ~ +19V. Optional Extended Temp.

8th and 9th Gen Intel® Platform

ESM-CFH
ESM-CFH

PICMG COM R3.0 Type 6 module, Intel® 9th/8th Gen Xeon®/Core™ i7/i5/i3 Processors with CM246/QM370 Chipset

Carrier Board for COM Express (COMe) Module

EEV-EX14
EEV-EX16

Micro ATX Type6 COM Express Carrier Board PICMG® COM Express® Revision 3.0

Contact us at BCMSales@bcmcom.com or give us a call 949-470-1888

Understand more about our Custom Industrial Motherboards and Open Frame Tablets