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Product End of Life (EOL) Notification

THIS PRODUCT IS ON THE PHASE-OUT LIST. BCM is accepting last time buy (LTB) orders through August 6, 2025. At BCM’s discretion, last time by orders may be scheduled to ship through February 6, 2026 with a non-cancellable and non-returnable (NCNR) PO. Please click HERE for details. For a replacement product please consider our MX610H, MX610HD, MX680RD, RX610H, RX680R, BC680R.

RX170Q Intel Q170 uATX Motherboard supports 6th/7th Generation 14nm Intel Kaby Lake/ Skylake Core i7/i5/i3 Processors

RX170Q

Intel® Q170 uATX Motherboard supports 6th/7th Generation 14nm Intel Kaby Lake/ Skylake Core i7/i5/i3 Processors

  • High Reliability Gold Plating Connectors
  • Intel LGA1151 socket supports 7th/6th generation 14nm Intel Kaby Lake¹ /  Skylake Core i7/i5/i3 and Celeron processors
  • 4 x (Gold Plated) DIMM slots support up to 64 GB
    Dual Channel DDR4 2133MHz System Memory
  • Supports 3 Independent Display
  • Video interfaces: 2 x DisplayPort (DP++) (Gold Plated), DVI and LVDS, Optional eDP
  • 1 x PCIe x16 Slot (Gold Plated) 
    1 x PCIe x4 Slot (x16 Physical Slot) (Gold Plated) 
    2 x PCIe x1 Slot Open End (Gold Plated) 
    1 x Full/Half Size mini-PCIe (Gold Plated) PCIe/ USB 
    1 x M.2 Slot (with PCIe x4 / SATA III) Type 2280 and 2260
  • Onboard USB: 2 x USB 3.0 (Gold Plated), 4 x USB 2.0 (Gold Plated) and 1 x USB 2.0 (1x5 Connector)
  • USB at Rear I/O: 4 x USB 3.0 and 2 x USB 2.0
  • 6 x SATA III (Gold Plated)
  • 6 x COM Ports
  • Optional TPM 2.0
  • Intel Active Management Technology 11
  • Kaby Lake processors support Win 10 and above; support Win 7 with external video cards
  • 6th Gen Skylake processors support Win 7

BCM's RX170Q uATX motherboard is designed to ensure the highest reliability utilizing gold plated pins for its critical high-speed connectors including memory, SATA, PCIe, power, M.2, and USB 3.0. Additionally, these connectors are locking type. This combination of gold plating and locking ensures superior high speed signal conductivity, wear and corrosion resistance in tough environments, and that critical connections stay connected. The RX170Q delivers high performance and higher reliability especially designed for test instruments, medical devices, video intensive applications, and any equipment that may be mobile and subject to connector wearing vibrations.

The RX170Q is a high performance and high reliability Micro ATX motherboard for applications that require intensive graphics and video performance or the capability to process multiple complicated tasks simultaneously. Such applications include medical imaging systems, CT Scanners, industrial x-ray scanning systems, microscopes & imaging equipment, test instruments, gaming devices, video servers, surveillance systems, and DVR systems, to name a few.

System
CPU Intel LGA1151 socket supports 6th/7th generation 14nm Intel Kaby Lake¹ /  Skylake Core i7/i5/i3 and Celeron processors
System Chipset Intel® Q170 PCH
System Memory 4 x DIMM (Gold Plated) support up to 64 GB Dual Channel DDR4 2133MHz System Memory
Optional ECC Memory Support
Audio Codec Realtek HD Audio support 7.1 channel sound playback
Ethernet LAN1: Intel® I219-LM Gigabit Ethernet Controller
LAN2: Intel® I210-AT Gigabit Ethernet Controller
BIOS AMI® 128Mb SPI BIOS
I/O Chip Nuvoton® NCT6106D or Equivalent
Expansion 1 x PCIe x16 Slot (Gold Plated) (Black)
1 x PCIe x4 Slot (x16 Physical Slot) (Gold Plated) (Yellow)
2 x PCIe x1 Slot Open End (Gold Plated) 
1 x Full/Half Size mini-PCIe (Gold Plated) PCIe/ USB 
1 x M.2 Slot (with PCIe x4 / SATA III) Type 2280 and 2260
Watchdog Timer Reset: 1 sec. ~ 255min. and 1sec. or 1min./step
H/W Status Monitor Monitoring System Temperature, Voltage, with Auto Throttling Control
TPM Optional TPM 2.0
Display
Graphics Engine Intel® Integrated Graphic
Display Interfaces 2 x DisplayPort (supports DP++) (Gold Plated), 1 x DVI-D, Optional eDP
Display Capability Supports 3 Independent Display
External I/O
KB/MS 1 x PS/2 Keyboard & Mouse
Audio Line-in, Line-out, Mic-in
USB 4 x USB 3.0 and 2 x USB 2.0
COM 1 x RS-232/422/485
LAN 2 x RJ45
DVI 1 x DVI-D
DisplpayPort 2 x DisplayPort (supports DP++) Connector (Gold Plated) 
Optional eDP
Internal I/O
LVDS 1 x 18/24 bits Dual Channel LVDS
USB 1 x 2x10 USB 3.0 Connector ( 2 x USB Ports) (Gold Plated)
2 x 2x5 USB 2.0 Connector ( 4 x USB Ports) (Gold Plated)
1 x 1x5 USB 2.0 Connector (1 x USB Port)
COM 5 x RS-232 Headers with Voltage Selection (2.0mm Pitch Locking Type)
SATA 5 x SATA III Connectors (Red) (Gold Plated)
1 x SATA III Connectors (Black) (Shared with M.2) (Gold Plated)
MIO 1 x LPT, 1 x SPI, 1 x Front Audio, 1 x Amplifier, 1 x Front Panel (Gold Plated), 1 x 8-bit GPIO, 1 x 4 Pin CPU Fan, 2 x 4 Pin Chassis Fan, 1 x Socket Type CMOS Battery Holder, 2 x LAN Status LED Headers, 1 x Backlight Locking Type Header (Gold Flashed), 1 x Chassis Intrusion Locking Type Header (Gold Flashed)
Mechanical and Environment
Power Type 1 x 24-pin ATX Connector (Gold Plated)
1 x 4-pin ATX 12 Connector (Gold Plated)
AT/ATX Mode Jumper
Operating Temperature 0 ～ 60°C （32 ～ 140°F）
Storage Temperature -20 ～ 80°C （-4 ～ 176°F）
Operating Humidity 5 ～ 90％ Relative Humidity, Non-condensing
Storage Humidity 5 ～ 90％ Relative Humidity, Non-condensing
Form Factor uATX (Micro ATX)
Dimensions (L) x (W) 9.6" (L) x 9.6" (W)
Certification Information CE, FCC Class B
Weight 1.45 lbs

* All product specifications and product images are subject to change without notice. Last update: 10/5/2023

BCM announces its Q170 and H110 series embedded motherboards now support the latest 7th generation Intel Core processors, codenamed Kaby Lake

BCM announces its Q170 and H110 series embedded motherboards now support the latest 7th generation Intel Core processors, codenamed Kaby Lake

BCM, a leading supplier of industrial motherboards and an associate member of Intel® IoT Solutions Alliance, announces a running change on its Q170 and H110 series industrial motherboards to support the latest 7th generation (Kaby Lake) Intel® Core™ processors on its existing motherboard platforms including the MX170QD, MX110HD, MX110H mini-ITX and RX170Q and RX110H micro ATX boards. 7th generation Kaby Lake support will be in addition to the currently supported 6th generation (Skylake) processors. This running change enables these motherboards to support two generations of processors extending their mainstream lifecycles while taking advantage of the 7th generation Core performance and feature enhancements. For customers who are looking for smaller embedded computing platforms in Kaby Lake, BCM offers its ESM-KBLH Type 6 COM Express module and ECM-KBLH 3.5” Single Board Computers. These running changes will take place starting in Q2, 2017. For more information please contact your BCM representative or email us at BCMSales@bcmcom.com....

BCM introduces five new 6th Gen Intel® Core™ Processor SoC industrial motherboards in uATX, mini-ITX and COM Express form factors including a new High Reliability line

BCM introduces five new 6th Gen Intel® Core™ Processor SoC industrial motherboards in uATX, mini-ITX and COM Express form factors including a new High Reliability line

BCM Advanced Research, a leading designer and manufacturer of industrial motherboards and systems since 1990, and an Associate member of the Intel® Internet of Things Solutions Alliance, today launched five new industrial motherboards based on the latest 6th generation Intel® Core™ processor family (codename Skylake). The new BCM motherboards include RX170Q and RX110H (micro-ATX), MX170QD and MX110H mini-ITX, and the ESM-QM170 (COM Express module) offer dramatically higher CPU and stunning graphics performance, a wide range of power and feature scalability, and new advanced features that boost IoT designs from the edge to the cloud.

Document
Datasheet
Manual
RoHS and REACH Declaration Letter
BIOS Version Revision Note Download
V1.60 For RX170Q Realtek ALC888S update. P/N: 71163
V1.20 BIOS Update for Meltdown and Spectra Issue. For P/N: 71163
Driver Description
Pre-install BIOS Flash Utility 
Chipset Intel(R) Chipset Device Software
Video Intel(R) Graphics Drivers
Audio Realtek HD Audio Driver
Ethernet Intel(R) Network Connections Software
Others Intel(R) Management Engine
  Infineon TPM Tool for TPM 2.0 Using Guide
Date Description Download
03/06/2025 End of Life (EOL) notice for the RX170Q due to Intel® end-of-life for its Skylake Series products. Please click HERE for Intel® PCN846571-00 reference document.
10/05/2022 REVISED Multi-product PCN for phasing out the Intel® I211 Ethernet Controller and phasing in the Intel® I210 Ethernet Controller. Please note there were hardware (H/W) revision inconsistencies with the previous notification sent on September 28, 2022. BCM apologizes for any inconvenience this may have caused our customers.
09/28/2022 Multi Product Hardware and BIOS PCN for phasing out the Intel® I211 Ethernet controller and phasing in the I210 Ethernet controller.
05/12/2022 PCN for the RX170Q series to address multiple components that are either EOL and/or highly constrained and severely impacting production lead-time.
12/14/2020 Multi-product change notice (PCN) to replace the audio codec on a significant number of BCM motherboards due to an end of life notification from the audio codec manufacturer. This change will involve both a BOM change (adding the replacement audio codec to the bill of materials) as well as a BIOS update to support the new audio codec.
12/07/2020 PCN for the RX170Q pertaining to a Vcore controller IC revision change from B to C
08/28/2018 PCN for including a warning insert into each carton in order to comply with California Proposition 65 regulations. 
04/24/2018 BIOS change notification addressing the Meltdown and Spectre security issue previous communicated by BCM in a product security bulletin sent out in January of this year  ../download/PCN/BCM_Product_Security_Bulletin_Meltdown-Spectre_011818.pdf

Please contact your BCM representative with any questions pertaining to this PCN.
8/30/2017 RX87Q, MX87QD, RX170Q, MX170QD PCN: To address an Intel® security advisory regarding a critical firmware vulnerability in certain systems that utilize Intel® Active Management Technology (AMT), Intel® Standard Manageability (ISM) or Intel® Small Business Technology (SBT). (Documented in Intel CVE-2017-5689).
11/14/2016 Multi-Product BIOS Change PCN (MX170QD, MX110H, RX170Q, RX110H, MX110HD)

Pre-notice of a pending multi-product BIOS change that will be implemented approximately in Q2/2017.  This change is being implemented to add support for the newest Kaby Lake CPUs on our current Skylake industrial motherboards.

BCM is committed to always providing the latest and most updated technology to our customers on any given product platform.  Although we try to avoid major changes as much as possible once a product is launched, when a significant technology enhancement such as this one becomes available so close after the initial launch of a new product we are compelled to make it available for the benefit of all customers.  The estimated release date for these new BIOS is late Q1/2017.  
08/25/2016 In order to comply with the latest product labeling regulatory requirements for shipping products with a Lithium battery installed, please find the attached packaging change notice from BCM covering multiple products.  This label is required to make transporters aware that the contents they are transporting do contain Lithium batteries.  This notification may result in the transporter requesting additional data for goods that will require air transport.

For Products: MX67QMD, MX67QMD-LC, MX255D, MX87QD, MX280NI, MX81H, MX81H-VS, MX1900J, MX110H, MX67QM, MX67QM-QC, MX61H, RX77Q, RX61H-U, RX87Q, RX87Q-TK, RX170Q, RX110H, RX67QV, RX67QV-LC, RX67QS, RX67Q, BC67Q, BC77Q, BC77Q-P, BC87Q, QS3845E, Others
Model Name Description
RX170Q Intel Q170 Micro ATX Motherboard

Contact us at BCMSales@bcmcom.com or give us a call 949-470-1888

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