Introducing High-Performance COM-HPC Module – ESM-HRPL
Powering Next-Generation Edge AI and Industrial Computing
The ESM-HRPL is a next-generation COM-HPC module designed for compute-intensive edge applications. Paired with the high-performance EEV-HC10 carrier board, this solution is ideal for AI inference, smart healthcare, industrial automation, and intelligent energy systems. It delivers exceptional processing power, modular scalability, and long-term product availability for critical embedded deployments.
Advanced COM-HPC Performance for Evolving Edge Architecture
The ESM-HRPL module complies with the PICMG® COM-HPC® Client Type specification and supports Intel® 12th, 13th, and 14th Gen Core™ processors (LGA 1700, up to 65W TDP), along with the Intel® R680E chipset. It includes four DDR5 SO-DIMM sockets supporting up to 128GB of memory at speeds up to 3600MT/s and optional ECC support, depending on the selected CPU.
The module is equipped with high-speed I/O including PCIe Gen5, dual 2.5GbE (Intel® I226-LM), USB 3.2 Gen2x2, eDP, and three DDI interfaces. These features ensure seamless data throughput and multi-device integration. Its modular architecture reduces platform development time, helps protect proprietary application knowledge through customized carrier board design, and supports differentiated system integration.
Versatile Expansion with the EEV-HC10 Carrier Board
The EEV-HC10 carrier board, designed in a standard EATX form factor (305 x 330mm) and compliant with COM-HPC Rev. 1.2, enhances the ESM-HRPL module’s capabilities. It includes up to four IET (Interface Expansion Technology) slots that support modular upgrades such as display output, USB, and 2.5G networking.
The board also features one PCIe Gen5 x16 slot and multiple PCIe x4/x1 slots to accommodate AI accelerators, GPUs, and other edge computing peripherals. In addition to PCIe expansion, it supports HDMI/DP/eDP, USB Type-C, RS-232, GPIO, and other essential industrial I/O interfaces—providing flexible deployment options across diverse AIoT applications.
Built for Demanding Edge AI Applications
The ESM-HRPL module is engineered for edge AI workloads that require high-throughput and low-latency performance. It is ideal for medical imaging, real-time AI inference, and intelligent grid management. With multi-channel video output and high-speed data transmission, it supports advanced diagnostics including MRI and CT scans.
In edge AI deployments, the module’s powerful CPU and scalable PCIe architecture allow smooth integration of GPUs and AI accelerators, improving model inference and decision-making efficiency. In energy and utility environments, its reliable I/O and edge processing capabilities support fast system response and remote control.
Flexible Cooling and Industrial Reliability
The ESM-HRPL incorporates a semi-modular thermal solution with a copper heat spreader and swappable heatsink design. This enables flexible cooling based on the CPU’s TDP, ensuring optimal thermal performance and system stability. The module also offers structural flexibility, hardware-level security, and professional ODM carrier board design services, making it suitable for high-performance embedded applications in mission-critical environments.
Long-Term Support and Complete Engineering Assistance
The COM-HPC ESM-HRPL module is built on Intel’s long-life platform roadmap and provides extended longevity support, making it suitable for industrial, healthcare, and infrastructure applications. It supports Windows 11 LTSC and a wide range of mainstream Linux distributions, with full access to documentation, development guides, and user manuals. BCM offers local engineering expertise and responsive service to help businesses simplify system integration and shorten time-to-market with confidence.
Contact BCM for sample availability and further technical documentation.
📧 Email: BCMSales@bcmcom.com
🔗 Website: https://www.bcmcom.com
