BCM Surpasses Performance Limits with Launch of Latest 5th Gen Intel® Xeon® Scalable Server Boards

Irvine, CA (January 10, 2024) - BCM Advanced Research, a Titanium tier member of the Intel® Partner Alliance, and a leader in industrial computing solutions and part of the Avalue Technology, Inc. group of companies, today unveiled its newest server board solutions - the HPM-ERSUA (single socket) and HPM-ERSDE (dual sockets) have added support for the new family of 5th Gen Intel® Xeon® Scalable processors in addition to the 4th Gen Intel® Xeon® Scalable processor series. Building on the success of the Sapphire Rapids series, Intel’s 5th Gen Xeon® Scalable Processor, codenamed Emerald Rapids, offers higher clock speeds, expanded caches, enhanced memory support, maximized core count per socket, and improved overall performance. “These server boards have been meticulously designed to meet the dynamic requirements of high-performance computing (HPC), cloud computing, data analysis, and artificial intelligence (AI) workloads in data centers,” said William Tung, Director of Product Planning at BCM.

As a long-standing Titanium member of the Intel® Partner Alliance, BCM is consistently at the forefront of new Intel® product and technology adoption . We are proud to be among the first to bring these new Intel® innovations to our customers," said Tom Skibinski, SVP of Sales and Marketing at BCM. "Our continued leadership in HPC is driven by our focus on extended life-cycles, exceptional reliability, and world-class customer support. With added product longevity and quality in our HPC motherboards, customers benefit from reducing re-certification cycles and lower total cost of ownership.

Unleashing AI and Graphics Prowess with the HPM-ERSUA (Single Socket), ATX Form Factor

With support for up to 4x full-height, double-wide GPU cards, the HPM-ERSUA is specifically designed to enable exceptional high-performance graphics and AI computing capabilities. The server's socket is compatible with 4th Gen Intel® Xeon® Scalable processors, ensuring compatibility with the latest platform without any hardware design modifications. In addition, the integration of cutting-edge DDR5 technologies increases memory speeds from 4800 to 5600 MT/s, enabling better performance compared to the 4th Gen Intel® Xeon® processor. The server also features a rugged 2.54mm PCB thickness that provides superior signal integrity and stability for continued, reliable operation.

Elevating Bandwidth and Connectivity with the HPM-ERSDE (Dual Sockets), Proprietary Form Factor (12" x 16.45")

The HPM-ERSDE is equipped with dual sockets supporting two 5th Gen Intel® Xeon® processors. The board offers a significant expansion of bandwidth, taking advantage of PCIe Gen5 to unlock opportunities for high-bandwidth acceleration cards. Its wide range of high-speed connectivity features, including 1x 1GbE port, 1x 2.5GbE port, and 2x 10GbE LAN options, ensure speedy data transfer, enabling optimized connectivity and reduced latency. The functional I/O interface guarantees zero interference and maximizes expandability with up to 7x PCIe 5.0 x16 slots, providing a wide range of I/O expansion options. In addition, its flexible storage expansion capabilities are underscored by the provision of 3x Slim SAS 8i (SFF-8654) connectors, each of which can be converted to 2x U.2 ports, to facilitate adaptable and scalable storage solutions.

With their superior processing power, seamless data throughput, and comprehensive management capabilities, HPM-ERSUA and HPM-ERSDE are ideal for demanding applications including medical imaging, manufacturing optimization, financial analysis, and machine learning.

“Embracing the Intel® 5th Gen Intel® Xeon® Scalable processors is a leap into the future of computing. The platform's unparalleled performance, cutting-edge technologies, and robust architecture provides improvement over previous generations. 5th Gen Intel® Xeon® Scalable processors offers workload-optimized performance and energy-efficient compute ensuring the technology foundation aligns seamlessly with our customer’s vision for unparalleled success in the digital era,” said William Tung, Director of Product Planning at BCM.

“The latest 5th Gen Intel® Xeon® Scalable platforms offer customers more compute, faster memory and AI acceleration in every core, resulting in exceptional performance and lower total cost of ownership (TCO) across critical workloads” stated Bassel Haddad, Vice President and General Manager, Edge Device and AI Products in Intel®’s Network and Edge Group. " The new processors are socket-, software- and platform-compatible with the previous generation, enabling BCM and their customers to benefit from extending the longevity of their infrastructure investments.”

HPM-ERSUA (Single Socket) Highlighted Features

HPM-ERSUA (Dual Sockets) Highlighted Features

For more information, US and North America customers please visit www.bcmcom.com.