EEV-EX15 is a carrier board in mini-ITX form factor designed with PICMG® COM Express® revision 3.0 to support Type 10 COMe mini modules including the ESM-APLM. EEV-EX15 supports rich IO interface including one LVDS, one eDP, one DP, one HDMI, two SATAIII, one COM Express connector, six USB2.0, two USB 3.1 (Gen1), one LAN, one SDIO, and one fan. Mic-in and line-out audio interfaces are provided. One PCIe x4 Slot is provided to support two types of PCIe expansion boards, PCIe and LAN, for testing. The PCIe expansion board provides additional PCIe slots; the LAN expansion board provides additional four LAN ports.
System
Form Factor
mini-ITX
I/O
Expansion
1 x PCIe x4
Video
1 x LVDS
1 x eDP
1 x DP
1 x HDMI
USB
2 x USB 3.1 (Gen1,contain 2 x USB2.0) 6 x USB2.0
SATA
2 x SATAIII
DIO
1 x 8bit GPIO
Audio
2 x Audio Jack (MIC In & Line Out)
Audio Codec
ALC892
Other
1 x SDIO1x SDIO/DIO (optional, depend on module board)
1 x LAN
Mechanical and Environment
Power Type
ATX
Operating Temperature
Standard: 0°C to 60°C (32°F ~ 140°F)
Storage Temperature
-40°C ~ 75°C (-40°F ~ 167°F)
Operating Humidity
0% ~ 90% Relative Humidity, Non-condensing
Dimensions (L) x (W)
6.7” x 6.7” (170mm x 170mm)
Weight
0.88 lbs (0.4kg)
Certification
CE, FCC Class B
* All product specifications and product images are subject to change without notice. Last update: 1/24/2019
BCM, an associate member of Intel® Internet of Things Solutions Alliance, has released its ESM-APLM Type 10 Computer-on-Module (COMe) mini module and its compatible carrier board EEV-EX15 in mini-ITX form factor. COMe mini module is an ultra-compact form factor. Its size measures 84mm x 55mm which is similar to the size of a credit card. The COMe mini module is designed for applications that require low power with a thermal design power (TDP) of 6 watts or lower. The COMe mini module is an ideal solution for small handheld devices for market segments including industrial, medical, transportation, outdoor digital signage, and outdoor controllers...
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BCM is a supplier of turn-key industrial motherboards and embedded computing solutions for well over two decades. Our Southern CA based R&D and PM teams provide fast paced and innovative ODM service with leading technology to meet most customer requirements while our manufacturing, global sourcing, and logistic teams work together to bring the most cost effective and highest quality solutions to our customers.
